By Robert W. Johnstone
An advent to Surface-Micromachining offers for the 1st time a unified view of surface-micromachining. increase from the elemental construction block of microfabrication concepts, to the final surface-micromachining layout, it's going to end with the idea and layout of concrete elements. An advent to Surface-Micromachining connects the producing approach, microscale phenomena, and layout facts to actual shape and serve as.
This ebook can be of curiosity to mechanical engineers seeking to cut back into micromachining and microelectronics designers seeking to stream horizontally to micromachining.
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Additional info for An Introduction to Surface-Micromachining
12 An inert gas mayaIso be used as a carrier. 13 The crystallographic directions which etch slowly are often called stop planes. 14 Typical temperatures for thermomechanical bon ding are 300 to 400°C. 28 AN INTRODUCTION TO SURFACE-MICROMACHINING 15 Thermosonic bonding occurs at temperatures around 150°C. M. ). VLSI Technolog)': 2nd Edition. McGraw-Hill, New York, 1988. [2) M. Madou. Fundamentals ofMicrofabrication. CRC Press, Boca Raton, Florida, 1997. E. Petersen. Silicon as a mechanical material.
Moving the sodium atoms away from the bonding surface makes the bonding surface chemically reactive. The glass surface then chemically reacts with the other wafer, typically silicon. The two wafers are then joined due to the chemical bonds. 2 Fusion Bonding In fusion bonding, two substrates are clamped together with a high contact force. 2). In practice, this means that the o wafer surfaces must have surface roughnesses less than 10 A, and the wafers must have a bow less than 5 p,m . This also means that the surfaces must be very clean before and during the bonding process.
In this process, one of the wafers is glass that contains sodium atoms. The high temperature increases the mobility of these atoms, allowing them to migrate in the electric field. Moving the sodium atoms away from the bonding surface makes the bonding surface chemically reactive. The glass surface then chemically reacts with the other wafer, typically silicon. The two wafers are then joined due to the chemical bonds. 2 Fusion Bonding In fusion bonding, two substrates are clamped together with a high contact force.
An Introduction to Surface-Micromachining by Robert W. Johnstone